SE97B_1
?NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 27 January 2010
5 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 2. Pin configuration for HWSON8
terminal 1
index area
1
A0
SE97BTP
002aae311
Transparent top view
2
A1
3
A2
4
8
7
6
5
V
SS
V
DD
EVENT
SCL
SDA
Table 3.
Pin description
Symbol
Pin
Type
Description
A0
1
I
I
2
C-bus/SMBus slave address bit 0 with internal pull-down. This
input is overvoltage tolerant to support software write protection.
A1
2
I
I
2
C-bus/SMBus slave address bit 1 with internal pull-down
A2
3
I
I
2
C-bus/SMBus slave address bit 2 with internal pull-down
V
SS
4
ground
device ground
SDA
5
I/O
SMBus/I
2
C-bus serial data input/output (open-drain). Must have
external pull-up resistor.
SCL
6
I
SMBus/I
2
C-bus serial clock input/output (open-drain). Must have
external pull-up resistor.
EVENT
7
O
Thermal alarm output for high/low and critical temperature limit
(open-drain). Must have external pull-up resistor.
V
DD
8
power
device power supply (3.0 V to 3.6 V)
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